| 摘要 |
A light emitting apparatus ( 10, 110, 210, 310, 410 ) includes one or more light emitting diode chips ( 12, 112, 212, 312, 412 ) disposed on a chip support wall ( 16, 116, 216 ) including printed circuitry ( 34, 134, 234, 360, 362, 460, 462 ) connecting with the light emitting diode chips. A heat pipe ( 24, 124, 224, 324, 424 ) has a sealed volume ( 22, 122, 222, 322, 422 ) defined by walls including the chip support wall and at least one additional wall ( 18, 20, 118, 120, 218 ). The heat pipe further includes a heat transfer fluid ( 26, 226, 326, 426 ) disposed in the sealed volume.
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