发明名称 |
Semiconductor device with reduced memory leakage current |
摘要 |
Defects in element forming regions on which memory cells of a non-volatile memory are formed are to be diminished to reduce leakage current. End portions of element forming regions with non-volatile memory cells formed thereon are extended a length D by utilizing the region which underlies a dummy conductive film, whereby a stress induced from an insulating film which surrounds the element forming regions is concentrated on the extended region. As a result, defects do not extend up to the regions where memory cells are formed and therefore it is possible to reduce leakage current in the memory cells.
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申请公布号 |
US7095074(B2) |
申请公布日期 |
2006.08.22 |
申请号 |
US20020196166 |
申请日期 |
2002.07.17 |
申请人 |
RENESAS TECHNOLOGY CORP. |
发明人 |
TSUKAMOTO KEISUKE;IKEDA YOSHIHIRO;OKAZAKI TSUTOMU;OKADA DAISUKE;YANAGITA HIROSHI |
分类号 |
H01L29/76;H01L29/78;H01L21/8247;H01L27/10;H01L27/105;H01L27/115;H01L29/788;H01L29/792 |
主分类号 |
H01L29/76 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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