发明名称 Semiconductor device with reduced memory leakage current
摘要 Defects in element forming regions on which memory cells of a non-volatile memory are formed are to be diminished to reduce leakage current. End portions of element forming regions with non-volatile memory cells formed thereon are extended a length D by utilizing the region which underlies a dummy conductive film, whereby a stress induced from an insulating film which surrounds the element forming regions is concentrated on the extended region. As a result, defects do not extend up to the regions where memory cells are formed and therefore it is possible to reduce leakage current in the memory cells.
申请公布号 US7095074(B2) 申请公布日期 2006.08.22
申请号 US20020196166 申请日期 2002.07.17
申请人 RENESAS TECHNOLOGY CORP. 发明人 TSUKAMOTO KEISUKE;IKEDA YOSHIHIRO;OKAZAKI TSUTOMU;OKADA DAISUKE;YANAGITA HIROSHI
分类号 H01L29/76;H01L29/78;H01L21/8247;H01L27/10;H01L27/105;H01L27/115;H01L29/788;H01L29/792 主分类号 H01L29/76
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