发明名称 Group III nitride compound semiconductor device
摘要 The present invention provides a Group III nitride compound semiconductor device in which the amount of a current allowed to be applied on a p-type pad electrode can be increased. That is, in the Group III nitride compound semiconductor device according to the present invention, a portion of a translucent electrode coming in contact with a circumferential surface of the p-type pad electrode is formed as a thick port ion to thereby increase the area of contact between the circumferential surface and the translucent electrode to thereby increase the current allowed to be applied on the p-type pad electrode. In addition, the use of the thick portion prevents cracking from occuring between the translucent electrode and the circumferential surface of the pad electrode.
申请公布号 US7095059(B2) 申请公布日期 2006.08.22
申请号 US20020220878 申请日期 2002.09.06
申请人 TOYODA GOSEI CO., LTD. 发明人 UEMURA TOSHIYA;HIRANO ATSUO;HORIUCHI SHIGEMI
分类号 H01L21/28;H01L21/205;H01L29/20;H01L29/43;H01L29/45;H01L33/32;H01L33/38;H01L33/42;H01L33/62 主分类号 H01L21/28
代理机构 代理人
主权项
地址