发明名称 |
Sensor semiconductor package, provided with an insert, and method for making same |
摘要 |
A semiconductor package includes a mounting and electrical connection plate, and a semiconductor component having front and rear surfaces and including a sensor. The rear surface of the semiconductor component is attached to the mounting and electrical connection plate and the front surface is attached to the sensor. An insert is adjacent the front face of the semiconductor component and the sensor and has an access passage for exposing the sensor. A plug is in the access passage of the insert. A body of encapsulation material surrounds the mounting and electrical connection plate, the semiconductor component and the insert.
|
申请公布号 |
US7095123(B2) |
申请公布日期 |
2006.08.22 |
申请号 |
US20030466191 |
申请日期 |
2003.11.10 |
申请人 |
STMICROELECTRONICS SA |
发明人 |
PRIOR CHRISTOPHE |
分类号 |
H01L23/28;H01L21/56;H01L31/0203 |
主分类号 |
H01L23/28 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|