发明名称 |
Method of forming a penetration electrode and substrate having a penetration electrode |
摘要 |
A method of forming a penetration electrode in which an electroconductive substance is inserted into a micropore that has one end blocked off only by wiring and a pad formed by an electroconductive substance without the wiring and pad being broken. In this method of forming a penetration electrode, an electroconductive substance is inserted into the micropore that penetrates a substrate and that has one aperture blocked off by an electroconductive thin film. After a protective member that holds the electroconductive thin film is provided on a surface on the electroconductive thin film side of the substrate, an electroconductive substance is inserted from the other aperture of the micropore.
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申请公布号 |
US7094677(B2) |
申请公布日期 |
2006.08.22 |
申请号 |
US20030736581 |
申请日期 |
2003.12.17 |
申请人 |
FUJIKURA LTD. |
发明人 |
YAMAMOTO SATOSHI;TAKIZAWA TAKASHI |
分类号 |
H01L21/28;H01L21/44;H01L21/768;H01L23/48;H05K1/03;H05K1/11;H05K3/40 |
主分类号 |
H01L21/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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