Method of forming a via contact structure using a dual damascene process,申请号KR20040052056-传众专利搜索

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发明名称	Method of forming a via contact structure using a dual damascene process
摘要
申请公布号	KR100615088(B1)	申请公布日期	2006.08.22
申请号	KR20040052056	申请日期	2004.07.05
申请人		发明人
分类号	H01L21/28	主分类号	H01L21/28
代理机构		代理人
主权项
地址

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