| 发明名称 |
PROVIDING IN PACKAGE POWER SUPPLIES FOR INTEGRATED CIRCUITS |
| 摘要 |
A packaged device may be provided with an in package power supply. The in package power supply may be selectively coupled to another component when the packaged device is not active. |
| 申请公布号 |
KR100613816(B1) |
申请公布日期 |
2006.08.21 |
| 申请号 |
KR20047015654 |
申请日期 |
2003.03.26 |
| 申请人 |
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发明人 |
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| 分类号 |
H01L21/60;G06F1/00;G11C5/14;G11C16/30;H01L23/00;H01L23/28;H01L23/498;H01L23/50;H01L25/065;H05K5/06;H05K7/00 |
主分类号 |
H01L21/60 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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