Connection pin welding defects detection method for printed circuit board, involves comparing measurement and reference profiles point by point to find defects based on number of points for which former profile is outside reference interval

摘要

The method involves establishing a reference profile obtained by assigning reference values to points of a digital image of connection pins of an electronic component (1). A measurement profile obtained by assigning measurement values to the points is established for each pin. The profiles are compared point by point to assess welding defects based on number of points for which the latter profile is outside a reference profile interval. The measurement values are determined corresponding to the reference values.