| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a and method of simply manufacturing an organic electronic device using an ultra-thin substrate. <P>SOLUTION: This method of manufacturing the organic electronic device is provided with a first process for grinding a first surface of the substrate, a second process for installing a protecting layer on the first surface, a third process for removing a second surface on the rear face of the first surface of the substrate by etching for thinning the thickness of the substrate, a fourth process for pinching layers containing a polymer material in gap in which the etched faces of two sheets of the ultra-thin substrates manufactured in the third process are oppositely pinched for pasting the two sheets of the substrate, a fifth process for removing a protecting layer, and a sixth process for forming an organic electronic device on the first surface in which a protecting layer has been removed. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
