发明名称 |
METHOD OF MANUFACTURING EPITAXIAL SEMICONDUCTOR SUBSTRATE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE |
摘要 |
PROBLEM TO BE SOLVED: To provide the method of manufacturing an epitaxial semiconductor substrate whose gettering ability is improved or the method of manufacturing a semiconductor device whose operating characteristic is improved. SOLUTION: In one embodiment of the method of manufacturing an epitaxial semiconductor substrate, a gettering layer grows on the semiconductor substrate. Then, an epitaxial layer can be formed on the gettering layer. A semiconductor device can be formed on the epitaxial layer. COPYRIGHT: (C)2006,JPO&NCIPI
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申请公布号 |
JP2006216934(A) |
申请公布日期 |
2006.08.17 |
申请号 |
JP20050339372 |
申请日期 |
2005.11.24 |
申请人 |
SAMSUNG ELECTRONICS CO LTD |
发明人 |
LEE HO;SHIN DONG-SUK;RHEE HWA-SUNG;UENO TETSUTSUGU;LEE SEUNG-HWAN |
分类号 |
H01L21/20;H01L21/205;H01L21/322;H01L27/146;H01L31/10 |
主分类号 |
H01L21/20 |
代理机构 |
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主权项 |
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地址 |
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