发明名称 METHOD OF MANUFACTURING EPITAXIAL SEMICONDUCTOR SUBSTRATE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To provide the method of manufacturing an epitaxial semiconductor substrate whose gettering ability is improved or the method of manufacturing a semiconductor device whose operating characteristic is improved. SOLUTION: In one embodiment of the method of manufacturing an epitaxial semiconductor substrate, a gettering layer grows on the semiconductor substrate. Then, an epitaxial layer can be formed on the gettering layer. A semiconductor device can be formed on the epitaxial layer. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006216934(A) 申请公布日期 2006.08.17
申请号 JP20050339372 申请日期 2005.11.24
申请人 SAMSUNG ELECTRONICS CO LTD 发明人 LEE HO;SHIN DONG-SUK;RHEE HWA-SUNG;UENO TETSUTSUGU;LEE SEUNG-HWAN
分类号 H01L21/20;H01L21/205;H01L21/322;H01L27/146;H01L31/10 主分类号 H01L21/20
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