| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermosetting resin molding material that can be easily manufactured, and is capable of suppressing the generation of air holes because wire flow is small, and filling property is high at the time of molding; and to provide the manufacturing method of a semiconductor device using the same. SOLUTION: The thermosetting resin composition for the molding material is soften or melted at 70 to 150°C. The molding material for the compression molding material and the manufacturing method of a resin-sealed semiconductor device using the molding material is molded in pellet or paste, and the thickness of the molding material is 3.0 mm or less. COPYRIGHT: (C)2006,JPO&NCIPI
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