| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor laser device with a remarkably longer service life with remarkably improved sealability between a case and cover glass, thereby getting less sensitive to an external atmosphere. SOLUTION: The semiconductor laser device includes a can and the cover glass stuck via fused glass and a plate having a semiconductor laser chip mounted, which are solidified by welding or the like. Concurrently, a groove and a plurality of holes are provided in the circumferential direction of the case on a resin seal on the foot of a plurality of lead terminal holes. The device has such a constitution that it is easily confirmed that an adhesive has flown entirely by pouring the colored adhesive from one of the holes until it appears on the other hole. COPYRIGHT: (C)2006,JPO&NCIPI
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