发明名称 |
Diamond conditioning of soft chemical mechanical planarization/polishing (CMP) polishing pads |
摘要 |
Conditioning of chemical mechanical planarization (CMP) using conventional diamond-embedded abrasive strips are well suited to condition conventional "hard" polishing but not soft polishing pads because the diamonds not only remove waste material, but they also damage the polishing surface of the pad. Embodiments of the present invention condition soft polishing pads using diamond strips without damaging the soft polishing pad.
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申请公布号 |
US2006183410(A1) |
申请公布日期 |
2006.08.17 |
申请号 |
US20060402449 |
申请日期 |
2006.04.12 |
申请人 |
YARDENI BARAK;ELDAD BOAZ;SLUTSKY PHILIP;DORON DAN |
发明人 |
YARDENI BARAK;ELDAD BOAZ;SLUTSKY PHILIP;DORON DAN |
分类号 |
B24B1/00;B24B21/18;B24B29/00;B24B37/04;B24B53/007 |
主分类号 |
B24B1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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