| 摘要 |
<P>PROBLEM TO BE SOLVED: To enable many bypass capacitors mounted on a mother board to be built as sheet-shaped capacitors in the interposer board of a semiconductor package so as to make semiconductors operate stably, and to provide a device in which a reduction of components can be achieved. <P>SOLUTION: The board is provided which is composed of a multilayer wiring board containing, at least, two wiring layers; a solid-state electrolytic capacitor which is formed between the wiring layers of the multilayer wiring board, and consists of an insulating oxide film layer, an electrolytic layer, and a conductor layer successively formed on one or both of the sides of a foil-like metal base; and a conductive member which is provided through the multilayer board in its thickness direction, wherein the conductor layer is connected to the ground electrode of the multilayer wiring board, and the foil-like metal base is connected to the power supply layer electrode of the multilayer wiring board. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
