| 摘要 |
A heat treatment apparatus for performing heat treatment to a semiconductor wafer (W) at a prescribed temperature is provided with a flexible heating plate (60), which is arranged in a treatment container main body (52) for storing the semiconductor wafer (W) and performs the heat treatment by bringing the semiconductor wafer (W) close to the surface of the heating plate or by placing the wafer on the surface of the heating plate; and a means (70) for bringing an arbitrary portion of the heating plate (60) into contact with or separating it from the semiconductor wafer (W). Thus, temperature control in accordance with warping of the semiconductor wafer (W) and an actual device is made possible, a uniform line width can be provided, and product yield can be improved. |
