LC FILTER COMPOSITE MODULE

摘要

An LC filter composite module wherein first built-in capacitors (C5, C6) provided inside a multilayer board (20) are arranged directly under chip type inductors (L1, L2), and the first built-in capacitors (C5, C6) are positioned in a region at least partially overlapped with the chip type inductors (L1, L2) in plane view. The chip type inductors (L1, L2), the first built-in capacitors (C5, C6) and second built-in capacitors (C1-C4) are electrically connected to configure a highpass filter (35). Ground electrode patterns (G1, G2) are provided with a notched section or an opening section (K) at a section directly below the chip type inductors (L1, L2). The first built-in capacitors (C5, C6) and the chip type inductors (L1, L2) are electrically connected through a via hole conductor (VH).