| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a high-quality solid-state imaging device which can be prevented from quality degradation by letting an overflown adhesive, if any, go into a concave portion at the time of bonding a first member. <P>SOLUTION: The solid-state imaging device comprises a semiconductor substrate whereon a solid-state imaging element including a light receiving region is formed, base mount formed on the semiconductor substrate outside the light receiving region, the first member bonded on part of the base mount, the concave portion formed in the base mount between the light receiving region and the first member, and second member which is supported by the first member and is arranged above the light receiving region to seal it. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
