| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a nozzle easily, inexpensively and for a short time which can suck an electronic component that is difficult to be sucked by an ordinary tubular nozzle of an electronic component mounter. <P>SOLUTION: A component suction 13 formed of a hardening material such as epoxy putty, instantaneous putty, etc. is provided at the tip end 12 of a nozzle 11. The suction surface of the component suction 13 is formed like a shape resembling a plane to be sucked of an electronic component to be sucked. Thus, even if the electronic component is sucked which is difficult to be sucked by an ordinary tubular nozzle (electronic component whose surface to be sucked is not flat), the suction surface of the nozzle 11 and the surface to be sucked of the electronic component are matched without spacing in-between, thus reducing air leakage as much as possible, and the electronic component can be stably sucked. In addition, the shape of the suction surface of the component suction 13 at the tip of the nozzle 11 can be changed in conformity to the shape of the surface to be sucked of the electronic component, so that low cost and shortened delivery time users request can be satisfied enough. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
