发明名称 |
PRODUCING SiC PACKS ON A WAFER PLANE |
摘要 |
The invention relates to a method for producing at least one semiconductor component group (3), particularly an SiC semiconductor component group (3). The invention is characterized by: producing a number of semiconductor components (1, 5) on a substrate, particularly on a wafer (7); testing the individual semiconductor components (1, 5) for detecting operational semiconductor components (1); assembling at least one semiconductor component group (3), which is comprised of a number of operational semiconductor components (1) and which forms a coherent flat structure, and; electrically connecting the operative semiconductor components (1) of the semiconductor component group (3) in parallel. |
申请公布号 |
WO2006084524(A2) |
申请公布日期 |
2006.08.17 |
申请号 |
WO2005EP57042 |
申请日期 |
2005.12.21 |
申请人 |
SIEMENS AKTIENGESELLSCHAFT;WEIDNER, KARL;WEINKE, ROBERT |
发明人 |
WEIDNER, KARL;WEINKE, ROBERT |
分类号 |
H01L21/66 |
主分类号 |
H01L21/66 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|