| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an apparatus of laser beam machining, which apparatus can accurately cut off a semiconductor substrate along planned cutting-off lines. <P>SOLUTION: The laser beam machining apparatus 100 forms reformed regions inside the semiconductor substrate 1 so as to become starting points of the cutting-off, and comprises: a mounting stand 107 on which the semiconductor substrate 1 is mounted; a laser beam source 101 for radiating the laser beam L; a condenser lens 105 which converges the laser beam L radiated from the laser beam source 101 inside the semiconductor substrate 1 mounted on the mounting stand 107, and forms the reformed regions at the position of the converged point P of the laser beam L; a stage control section 115 and an overall control section 127 for moving the converged point P of the laser beam L along the planned cutting-off lines 5 arranged on the semiconductor substrate 1; an infrared transparent illuminator 116 for illuminating the semiconductor substrate 1 mounted on the mounting stand 107 by infrared rays; and an image pickup element 121 for imaging the reformed regions formed inside the semiconductor substrate 1 illuminated by infrared rays by means of the infrared transparent illuminator 116. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
