| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device through which a package can be made thin. SOLUTION: A plurality of semiconductor chips 12-1 to 12-3 are stacked on a substrate 11 having external connection electrodes 14-1, 14-2, 14-3, ... through connection electrodes 16-1, 16-2, 16-3. At least one semiconductor chip comprises through electrodes 15-1, 15-2, 15-3 formed in through holes penetrating the semiconductor chip through an insulation layer and being connected electrically with a semiconductor element, and overhang portions 17-1, 17-2, 17-3 or trenches formed at positions corresponding to the through electrodes on the rear surface of the semiconductor chip and forming a section for containing the connection electrode between the overhang portion and the substrate or the major surface of the semiconductor chip arranged at a lower stage. COPYRIGHT: (C)2006,JPO&NCIPI |
