| 摘要 |
PROBLEM TO BE SOLVED: To develop a mold release film which prevents the fusion between a cover lay and a metal sheet used in heating and pressurization from occurring, a drained adhesive from adhering to another member, and free from the formation of a void in a non-printing part, and the contamination of the exposed surface of an electric circuit with the drained molten adhesive when a flexible printed circuit board is produced and to provide the mold release film which can be used in the production of the flexible printed circuit board good in appearance. SOLUTION: The mold release film which has an intermediate layer containing a flexible polyolefin, is obtained by stretching a laminate having at least one outermost layer containing poly(methylpentene), and has a thermal shrinkage factor of 0.5-5% in the stretching direction is used when the cover lay is adhered to the flexible printed circuit board. COPYRIGHT: (C)2006,JPO&NCIPI
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