发明名称 PROCEDURE FOR STAMPING A PLASTIC FOIL INTO THE IMPROVED CHIP-BOARD
摘要 Procedure provided for in this invention is done in a device (1) that is actually a press, in that a board (2) from the improved chip-board by a flatting endless belt (6), a plastic foil (4) is brought and by means of it to press mutually together a guided belt (13) are entered into a segment for injecting the steam (5) and wherein the upper surface layer on the board (2) impacted by the pressure and the steam is heated and softened. When it comes in contact with the cooler surface layer the surplus of steam is condensed, therein it plastifies the surface layer of the board (2) and the plastic foil (4) are introduced where the vacuum drains away the surplus of the steam thereby reducing the pressure in the surface layer of the board (2) that in that much reduces its internal resistance toward the compression, in that it uses for stamping the plastic foil (4) into the board (2).
申请公布号 YU93603(A) 申请公布日期 2006.08.17
申请号 YU2003P000936 申请日期 2003.11.25
申请人 KOJIC, BORIVOJE 发明人 KOJIC, BORIVOJE
分类号 B27N3/26;(IPC1-7):B27N3/26 主分类号 B27N3/26
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