发明名称 HIGH FREQUENCY DEVICE
摘要 PROBLEM TO BE SOLVED: To solve the problem that there is a limit in suppression of non-matching due to formation of a short course between ground patterns and installation of a non-forming part of a conductor in a high frequency device. SOLUTION: The device is provided with a first signal pattern and a first ground pattern which are installed respectively on a surface and a rear face of a dielectric substrate, a first dielectric layer arranged adjacently to the first signal pattern, a high frequency device installed in a recess, a second signal pattern which is disposed on the first dielectric layer and is electrically connected to the high frequency device, a connection means which electrically connects the first signal pattern and the second signal pattern through a through-hole formed in the first dielectric layer, a second dielectric layer which is installed on the first dielectric layer and the second signal pattern and opens the surface of the high frequency device, and a second ground pattern which is arranged on the second dielectric layer and is disposed on the first signal pattern and the second signal pattern. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006216686(A) 申请公布日期 2006.08.17
申请号 JP20050026593 申请日期 2005.02.02
申请人 MITSUBISHI ELECTRIC CORP 发明人 MORIMOTO TAKAO
分类号 H01L23/12;H01P5/02 主分类号 H01L23/12
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