| 摘要 |
PROBLEM TO BE SOLVED: To form wiring whereby a reliability as a wiring device is enhanced, by suppressing the occurrence of leakage currents between wiring portions and reducing damage to the wiring portions. SOLUTION: A barrier layer is formed on the surface of a substrate formed with a recess for wiring in an insulating layer, a wiring material is formed on the surface of the barrier layer and prepares the substrate with the wiring material embedded in the recess for wiring, wiring is formed by the wiring material embedded in the recess for wiring by removing extra wiring material and a barrier layer formed on the surface of the substrate, and a contaminant substance on the substrate is removed by allowing it to react with carboxylic acid under heating in an atmosphere containing the carboxylic acid. COPYRIGHT: (C)2006,JPO&NCIPI |
