发明名称 CHEMICAL POLISHING LIQUID, CHEMICAL POLISHING METHOD AND METALLIC MATERIAL
摘要 PROBLEM TO BE SOLVED: To provide a chemical polishing liquid with which, in a metallic material having a sharp corner part on the surface, the corner part can be preferentially etched/polished, and rounded, to provide a chemical polishing method, and to provide a metallic material produced by being subjected to chemical polishing. SOLUTION: The chemical polishing liquid comprises: an oxidizing agent of etching a metallic material; a film forming agent of forming a corrosion resistant film on the surface of the metal so as to prevent its oxidation caused by the oxidizing agent; and a dissolving agent. The film forming agent is hard to stick to the sharp corner part, and, even if it sticks thereto, the film is formed only thinly compared with a flat part. Thus, the oxidizing agent in the mixed liquid does not substantially etch the flat part, but preferentially etches/polishes the corner part, and can round the same. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006213970(A) 申请公布日期 2006.08.17
申请号 JP20050028631 申请日期 2005.02.04
申请人 TOPPAN PRINTING CO LTD 发明人 TAKAGI NOBUO;UEDA RYUJI;TANAKA SATOSHI;MATSUZAWA HIROSHI;KOGA OSAMU;ONODA YUSUKE;YABUTA EIJI
分类号 C23F1/28;H01J9/02;H01J11/02;H01J11/22;H01J11/34;H01J11/36 主分类号 C23F1/28
代理机构 代理人
主权项
地址
您可能感兴趣的专利