Composition and method to form articles simulating stone

摘要

A thermoplastic composition used to form resin chips is disclosed. The thermoplastic composition comprises a plurality of particles having a density of 2.2 or greater encapsulated within a thermoplastic resin, where the plurality of particles does not offgas when heated to a temperature of 500° F., and where the thermoplastic resin has a Barcol Hardness of 30 or greater.