| 摘要 |
PROBLEM TO BE SOLVED: To simplify processes and furthermore, to obtain a surface acoustic wave device with further reduced size. SOLUTION: The manufacturing method includes an electrode forming step of providing interdigital electrodes 12 onto a piezoelectric substrate 11; a jointing step of connecting the piezoelectric substrate 11 to a wiring board aggregate 15; a first dicing step of dicing only the piezoelectric substrate 11; a sealing step of filling in air gaps, formed by the first dicing step by a gel state curing sheet 16 and curing the gel sheet 16; and a second dicing step of dicing the wiring board aggregate 15 and a sealing member 17, resulting from the cured gel state curing sheet on the aggregate 15 to separate individual devices, and can simplify the processes and reduce the size of the products. COPYRIGHT: (C)2006,JPO&NCIPI
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