| 摘要 |
PROBLEM TO BE SOLVED: To provide a nickel plating bath which minimizes the growth of a plated film on a part except an electroconductive part of an article to be plated, and reliably imparts adequate solder wettability to a plated article. SOLUTION: The nickel plating bath includes a sulfate-based salt of nickel such as nickel sulfate, a halogen compound such as nickel chloride and a pH buffer such as boric acid, wherein the pH is adjusted to 2.2 to 5.5 and a molar concentration ratio x/y of nickel ions (x) and halide ions (y) is controlled so as to satisfy 0.5<x/y≤1.0. A multilayer ceramic capacitor produced with the use of the nickel plating bath has nickel films 7a and 7b precedently deposited on external electrodes 6a and 6b, and makes a plated film minimal on a ceramic material 1. COPYRIGHT: (C)2006,JPO&NCIPI
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