摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component device excellent in reliability and an adhesion sheet used for the electronic component device which prevent a void from occurring between a support member and an adhesion sheet used as a die attach film, and prevent exfoliation caused by the void. SOLUTION: The electronic component device is constituted such that an electronic component chip 2 is adhered on the support member 4 by an adhesive layer 3 consisting of an adhesion sheet. The electronic component chip is adhered to the support member so that the void should not exist in the interface of the adhesives layer and the support member. COPYRIGHT: (C)2006,JPO&NCIPI
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