Semiconductor light emitting device, light emitting module and lighting apparatus

摘要

An LED array chip ( 2 ) includes blue LEDs ( 6 ) and red LEDs ( 8 ). The blue LEDs ( 6 ) are formed by epitaxial growth on an SiC substrate ( 4 ). Bonding pads ( 46 and 48 ) are formed on the SiC substrate ( 4 ) in a wafer fabrication process. The red LEDs ( 8 ) are separately manufactured from the blue LEDs ( 6 ), and flip-chip mounted on the bonding pads ( 46 and 48 ) formed on the SiC substrate.