<p>An endoscope device, using a two-component reactive adhesive which is prepared by mixing a base resin containing at least one of a bis-phenol A type epoxy resin and a bis-phenol F type epoxy resin and 5 to 15 wt % of an acrylic rubber fine powder having an average particle diameter of 300 nm or less, with a curing agent containing a dimer acid, diethylene triamine and diethylenetriamine monomer as main components.</p>
