| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a thermal head whose manufacture is easy and in which a wire bonding with high adhesion can be performed even in the case of forming thinly. <P>SOLUTION: The thermal head is equipped with a lot of heating resistors 13a, 13b formed at a fixed spacing, an individual conductor 14 individually connected to each of the heating resistors 13a, 13b as a conductor to apply a current to each of them and a common conductor 15 commonly connected to each of the heating resistors 14a, 14b. In the thermal head, an underlayer 19 with a lot of concavo-convex 19b, 19a is formed as an electrode of the individual conductor 14 or the common conductor 15, and a conductor layer 14' is formed on the underlayer 19 along the above concavo-convex 19b, 19a, and then a bonding pad 17 with concavo-convex 17b, 17a is formed with the conductor layer 14'. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
