| 摘要 |
In a semiconductor device, a spacer layer is formed around an imaging element on a semiconductor substrate and a glass lid is combined to the spacer layer via an adhesive layer. A space is made between the semiconductor substrate and the glass lid so as to be positioned at a region where the imaging element is disposed. As a result, in forming a hollow section between a light transmitting material and an active element on the semiconductor substrate, it is unnecessary to apply a large load and to superimpose patterns when the light transmitting material is combined to the semiconductor substrate.
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