发明名称 |
MULTI-LAYER PRINTED CIRCUIT BOARD COMPRISING A THROUGH CONNECTION FOR HIGH FREQUENCY APPLICATIONS |
摘要 |
A high frequency multi-layer printed circuit board, according to the present invention, comprises a through connection having an impedance adapting structure surrounding the through connection and enabling an adjustment of the characteristic impedance of the through connection to a desired value. Thus, high frequency signals may be led through the printed circuit board with reduced signal deformation. The high frequency multi-layer printed circuit board is applicable for high frequency signals up to the GHz-range. |
申请公布号 |
WO2006065539(A3) |
申请公布日期 |
2006.08.17 |
申请号 |
WO2005US43399 |
申请日期 |
2005.11.29 |
申请人 |
ADVANCED MICRO DEVICES, INC.;KALUZNI, HEIKO;HUSCHKA, ANDREAS |
发明人 |
KALUZNI, HEIKO;HUSCHKA, ANDREAS |
分类号 |
H05K1/02 |
主分类号 |
H05K1/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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