PROCESS FOR PREPARING A POLYMERIC RELIEF STRUCTURE

摘要

The present invention relates to a process for the preparation of a polymeric relief structure by a) coating a substrate with a first coating composition comprising one or more radiation-sensitive ingredients, d) locally treating the coated substrate with electromagnetic radiation having a periodic or random radiation-intensity pattern, forming a latent image, e) polymerizing and/or crosslinking the resulting coated substrate to a first coating. This process is improved by applying a second coating composition on top of the first coating composition, said second coating composition comprising either an organic compound (C_o) of a monomeric nature and wherein C_o is also polymerized during the process, or wherein said second coating comprises a dissolved polymer (C_p). As a result a polymeric relief structure is obtained, where a substrate is coated with a functional, stacked, bi-layer, in which each layer exhibits a specific, and from each other differing function.