发明名称 |
Forming a cap above a metal layer |
摘要 |
In one embodiment, the present invention includes an apparatus having a metal layer with a pad disposed above a substrate; and a cap disposed above the metal layer having a first portion to provide for contact with a probe and a second portion to provide a bonding surface, and the cap is electrically coupled to the pad.
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申请公布号 |
US2006180945(A1) |
申请公布日期 |
2006.08.17 |
申请号 |
US20060402777 |
申请日期 |
2006.04.12 |
申请人 |
SESHAN KRISHNA;JENG KEVIN;DUN HAIPING |
发明人 |
SESHAN KRISHNA;JENG KEVIN;DUN HAIPING |
分类号 |
H01L23/48;H01L23/485 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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