| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To improve characteristics of a resin sealed semiconductor device where a die pad is exposed from the top surface of a sealed resin. <P>SOLUTION: The resin sealed semiconductor device includes a die pad 13, a plurality of suspension leads 14 for supporting the die pad 13, a lead 12 for connecting signals, a semiconductor chip having an electrode pad on its principal surface and supported by the lower surface of the die pad 13 with the principal surface being downward, a connection member for connecting between the electrode pad of the semiconductor chip and the lower surface of the inner area, that is the die pad side, of the lead 12 for connecting signals, and a sealing resin for sealing the die pad 13, the semiconductor chip, the lead 12 for connecting signals, and the connection member so as to expose the lower surface of the outer area of the lead 12 for connecting signals. Each suspension lead 14 has a curved portion 45 for exposing a part of itself from the sealed resin. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
