| 摘要 |
A method of fabricating an image sensor includes the steps of sequentially stacking a metal layer and a nitride layer over a semiconductor substrate divided into an active area and a pad area; forming a metal pad on the pad area by selectively patterning the nitride layer and the metal layer; forming a protecting layer over the semiconductor substrate including the metal pad, forming a pad opening over the metal pad by selectively removing the protecting layer until a surface of the nitride layer is exposed; forming a color filter layer over the active area of the semiconductor substrate; forming a microlens over the color filter layer; and selectively removing the nitride layer exposed via the pad opening.
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