| 摘要 |
A structure provides for the control of bond wire impedance. In an example embodiment, there is an integrated circuit device ( 100 ) comprising an integrated circuit ( 130 ) having a plurality ( 115 ) of grounding pads, signal pads, and power pads and a package ( 110 ) for mounting the integrated circuit and includes a conductive path having at least one reference trace ( 140 ) that surrounds the integrated circuit. A grounding arch ( 170 ) formed by a dielectric-coated metal tape is disposed over the integrated circuit and connected to its ground pad in order to provide heat dissipation and EMI shielding.
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