| 摘要 |
A pressure sensor includes a sensor chip in which a diaphragm is provided, and a case to which the sensor chip is directly mounted by an adhesive. A groove that surrounds the diaphragm is provided on the rear surface of the sensor chip between the bonded part and the diaphragm. The groove prevents thermal stress, which occurs at the bonded part, from reaching the diaphragm through the sensor chip, and thereby the accuracy of the sensor output is highly accurate. Further, the groove may store any excessive adhesive that may be applied when the sensor chip is bonded to the case to prevent the adhesive from flowing and adhering to the diaphragm.
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