发明名称 PELTIER BASED HEAT TRANSFER SYSTEMS
摘要 Heat transfer systems are presented with improved heat dissipation schemes based upon an asymmetric arrangement of Peltier elements to form a hot side of greater area than the cold side. This permits greater heat dissipation at the hot side of the heat transfer device into a suitable heat sink. A substantially planar system of radial symmetry is the basis of a highly efficient heat spreading scheme. The 'spokes' of the system are pie­wedge shaped Peltier semiconductor elements having a small heat transfer junction at one end and large heat transfer junction at the other.. In best versions, a concentric ring scheme has a cooled area at the center and a heat dump at the periphery. Semiconductor Peltier elements connect the two and provide a vehicle to carry heat radially away from a heat point source thermally coupled to the heat transfer system at an active area. These special arrangements are provided while still maintaining the necessary serial electronic circuit and parallel thermal circuit.
申请公布号 WO2006085179(A2) 申请公布日期 2006.08.17
申请号 WO2006IB00200 申请日期 2006.01.23
申请人 ACOL TECHNOLOGIES SA;ABRAMOV, VLADIMIR SEMENOVICH;SUSHKOV, VALERY;SHISHOV, ALEXANDER VALERIEVICH;SCHERBAKOV, NIKOLAY VALENTINOVICH 发明人 ABRAMOV, VLADIMIR SEMENOVICH;SUSHKOV, VALERY;SHISHOV, ALEXANDER VALERIEVICH;SCHERBAKOV, NIKOLAY VALENTINOVICH
分类号 H01L35/32;H01L33/64 主分类号 H01L35/32
代理机构 代理人
主权项
地址