Polishing compositions and methods for removing barrier materials from a substrate surface are provided. In one aspect, a composition is provided for removing at least a barrier material from a substrate surface including an acid based electrolyte system, one or more chelating agents, one or more pH adjusting agents to provide a pH between about 3 and about 11, and a solvent. The composition may be used in an electrochemical mechanical planarization process. The polishing compositions and methods described herein improve the effective removal rate of barrier materials from the substrate surface with a reduction in planarization type defects.
申请公布号
WO2006086265(A2)
申请公布日期
2006.08.17
申请号
WO2006US04013
申请日期
2006.02.02
申请人
APPLIED MATERIALS, INC.;ZHAO, JUNZI;LIU, FENG, Q.;WANG, YOU;TSAI, STAN, D.
发明人
ZHAO, JUNZI;LIU, FENG, Q.;WANG, YOU;TSAI, STAN, D.