发明名称 |
INTERPOSER, PROBE CARD AND METHOD FOR MANUFACTURING INTERPOSER |
摘要 |
<p>Disclosed is an interposer comprising a silicon substrate (20). A plurality of conduction holes (27) penetrating the silicon substrate (20) are formed by dry etching, and at least one end of each conduction hole (27) is provided with a probe (12) via a pad (45). Since conduction holes are formed in a substrate which can be processed by dry etching, a plurality of fine conduction holes can be continuously formed and a probe can be connected to each conduction hole. Consequently, there can be obtained an interposer wherein probes are arranged at high density.</p> |
申请公布号 |
WO2006085573(A1) |
申请公布日期 |
2006.08.17 |
申请号 |
WO2006JP302238 |
申请日期 |
2006.02.09 |
申请人 |
TOKYO ELECTRON LIMITED;YAKABE, MASAMI;HOSHINO, TOMOHISA |
发明人 |
YAKABE, MASAMI;HOSHINO, TOMOHISA |
分类号 |
G01R1/06;G01R1/073;H01L21/66 |
主分类号 |
G01R1/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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