| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a device and a method capable of simultaneously polishing a large number of base boards by a single polishing pad, while reducing local excessive polishing of the base boards. <P>SOLUTION: This carrier head 24 is composed of a cavity 112 of indwelling bellows 110 for preventing a twist of a carrier, and a chamber 144 composed of an upper wall 138, an external circular wall 140 and a lower contour wall 142 in a lower part of the cavity, and a pressurized fluid is supplied in the bellows and the chamber from respectively different flow passages. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
