| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an image sensor module of a wafer level used in a digital machinery and tools, etc, and to provide a manufacturing method thereof. <P>SOLUTION: The image sensor module of the wafer level includes an optical filter for removing a particular wavelength from light flown in the image sensor, a glass layer stuck on the optical filter to protect a filter coating layer and having a pad electrode, etc, formed on the back surface thereof, an image sensor stuck on the pad electrode of the glass layer and having a re-distribution pad formed on the back surface thereof from the pad electrode, a solder ball arranged on the back surface side of the image sensor and electrically connected to the pad electrode, and a manufacturing method thereof. By reducing a size to minimum, selecting only the image sensor module of excellent quality, and making it usable; reduction of a manufacturing cost can be achieved and an effect profitable to a mass production is provided. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
