发明名称 IMMERSION LITHOGRAPHY PROCESS AND STRUCTURE THEREFOR
摘要 <P>PROBLEM TO BE SOLVED: To solve a problem that a chemical substance in a photo resist layer diffuses into an immersion liquid and a T-shaped end is produced in photo resist pattern after being developed, and to provide an immersion lithography process to improve the level of analysis of the process. <P>SOLUTION: In the immersion lithography process, the photo resist layer is formed on a material layer, and an acid compensating layer is formed on the photo resist layer. An immersion exposure process is performed for the acid compensating layer and the photo resist layer. After the immersion exposure process is performed, the concentration of photoacid in the acid compensating layer generated by the photoacid generator included in the acid compensating layer is higher than the concentration of photoacid in the photo resist layer generated by the photoacid generator included in the photo resist layer. Subsequently, a development process is performed for the acid compensating layer and the photo resist layer, and patterning of the acid compensating layer and the photo resist layer is performed. <P>COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006216928(A) 申请公布日期 2006.08.17
申请号 JP20050165627 申请日期 2005.06.06
申请人 WINBOND ELECTRON CORP 发明人 SAI KOZAI;O SHODAN
分类号 H01L21/027;G03F7/11 主分类号 H01L21/027
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