| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a light emitting device comprising a thermal conduction course having excellent thermal conductivity. <P>SOLUTION: There is provided a flip chip LED comprising a luminescent structure, a first dielectric layer, a first metal layer, a second metal layer, and a second dielectric layer. The luminescent structure comprises a first conductive layer, an active layer, and a second conductive layer. The active layer is arranged on the first conductive layer. The second conductive layer is arranged on the active layer. The first metal layer is arranged on the luminescent structure. The first metal layer is in touch with the first conductive layer. A part of the first metal layer is arranged on the first dielectric layer. The second metal layer is arranged on the luminescent structure, The second metal layer is in touch with the second conductive layer. A part of the second metal layer is arranged on the first dielectric layer. The second dielectric layer is arranged on the first dielectric layer. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
