FILM PATTERN FORMING METHOD, FILM PATTERN, RESIST FILM, INSULATED FILM, CIRCUIT BOARD, SEMICONDUCTOR DEVICE, SURFACE ACOUSTIC WAVE DEVICE, SURFACE ACOUSTIC WAVE OSCILLATION DEVICE, ELECTRO-OPTICAL DEVICE AND ELECTRONIC EQUIPMENT

摘要

PROBLEM TO BE SOLVED: To realize a film pattern forming method by which a film pattern having a predetermined pattern shape and predetermined thickness can be formed while restraining a liquid material from flowing out of a film pattern forming area and spreading wetly to the outside of the film pattern forming area and to realize the film pattern, a resist film, an insulated film, a circuit board, a semiconductor device, a surface acoustic wave device, a surface acoustic wave oscillation device, an electro-optical device and electronic equipment. SOLUTION: A peripheral zone film 7a is formed by making the surface of a substrate 1 liquid-repellent and arranging a liquid droplet 4 of the liquid material in the peripheral part of a resist film 9 forming area 2. A central film 8 is formed by making the surface of the substrate 1 lyophilic and packing the liquid material in the area surrounded by the peripheral zone film 7a. The resist film 9 is formed from the peripheral zone film 7a and the central film 8. The insulated film is formed in the same way. Each of the circuit board, the semiconductor device and the surface acoustic wave device has the film formed by the above film pattern forming method. The electro-optical device has this semiconductor device. The electronic equipment has this electro-optical device, this circuit board and the surface acoustic wave oscillation device. COPYRIGHT: (C)2006,JPO&NCIPI