CHIP COMPONENT PROVIDED WITH ELECTROSTATIC PROTECTION FUNCTION
摘要
<p>A chip component provided with electrostatic protection function is provided with a substrate; a circuit element formed on the substrate; an electrostatic protection element formed parallel to the circuit element on the substrate; and a pair of external electrodes formed on the both end sections of the substrate for connecting the circuit element and the protection element with an external circuit.</p>
申请公布号
WO2006085492(A1)
申请公布日期
2006.08.17
申请号
WO2006JP301883
申请日期
2006.02.03
申请人
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.;TOKUNAGA, HIDEAKI;INOUE, TATSUYA